Ruggedized Edge AI and Embedded Computing
Powered By NVIDIA Jetson™ Modules
Premio Inc. and NVIDIA
Accelerated Embedded Computing
As a NVIDIA Partner for the embedded compute competency, Premio Inc leverages cutting-edge technology for AI Inference at the edge. This collaboration empowers Premio to push the boundaries of innovation and productization for its portfolio of ruggedized computing hardware in a new age of AI and edge computing.
Key Benefits
Enhanced AI Capabilities: Access to NVIDIA’s cutting-edge Jetson platform and GPU technology, enabling rapid development of AI applications.
Industry-Leading Solutions: Ruggedized Edge AI Computers (JCO Series), EDGEBoost Technology for AI performance acceleration and Rich I/O expansions, and Scalable NVIDIA Jetson Modules
Comprehensive Support: Leveraging NVIDIA’s extensive resources and expertise to ensure customer success and satisfaction.
Faster Time to Market: Capabilities in ODM customization, engineering and turnkey manufacturing for rapid deployment in the USA.
JCO Series: AI Edge Fanless Industrial Computers
Jetson AGX Orin
- Best Edge AI (TOPS) Performance
- Unmatched I/O Configurations
- EDGEBoost I/O Technology
- Certification Ready: UL, FCC, CE
Jetson Orin NX
- Mid-Level Edge AI (TOPS) Performance
- Small Form Factor I/O configuration
- Certification Ready: UL, FCC, CE
Jetson Orin Nano
- Entry-Level Edge AI (TOPS) Performance
- Ultra-Mini fixed I/O configuration
- Certification Ready: UL, FCC, CE
NVIDIA Jetson System on Modules
Jetson AGX Orin Series
High Performance
- Jeton AGX Orin System on Module (32GB/64GB)
- Up to 275 TOPS AI Performance
- Low-Power Configurations (15W and 60W)
Jetson Orin NX Series
Mid Performance
- Jeton NX Orin System on Module (16GB/8GB)
- Up to 100 TOPS AI Performance
- Low-Power Configurations (10W and 25W)
Jetson Orin Nano Series
Entry Performance
- Jeton Nano Orin System on Module (8GB/4GB)
- Up to 40 TOPS AI Performance
- Low-Power Configurations (7W and 15W)
Rugged Fanless
Maximized Expandability
Wide Temperature
Shock And Vibration Resistance
World Class Certifications
3 Scalable Models to Meet Edge AI Workloads
Designed for Edge AI: JCO Series Comparison
 JCO-6000-ORN |
 JCO-3000-ORN |
 JCO-1000-ORN |
||
|---|---|---|---|---|
| System | AI Accelerator | Jetson AGX Orin 64 GB/32GB | Jetson Orin NX 8G/16G or Nano 8G/4G |
Jetson Orin Nano 8G/4G |
| CPU | 8-core/12-core Arm® Cortex®-A78AE v8.2 64-bit CPU | 8-core/6-core Arm® Cortex A78AE v8.2 64-bit CPU | 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU | |
| GPU |
• Jetson AGX Orin 64GB: 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores • Jetson AGX Orin 32GB: 1792-core NVIDIA Ampere architecture GPU with 56 Tensor Cores |
• Jetson NX 16GB/8GB: 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores • Jetson Orin Nano 8GB/4GB: 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
• Jetson Orin Nano 8GB: 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores • Nano 4G: 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
|
| Memory & Storage | System Memory | 32 GB/64 GB LPDDR5 | 16GB/8GB LPDDR5 8GB/4GB LPDDR5 |
8GB/4GB LPDDR5 |
| NVMe | 1x M.2 (M Key, 2242/2260/2280, PCIe x4, Support NVMe | 1x M.2 (M Key, 2242/2260/2280, PCIe x4, Support NVMe | 1x M.2 (M Key, 2242/2260/2280, PCIe x4, Support NVMe | |
| eMMC | 1x eMMC (64 GB) | (-) | (-) | |
| SIM Sockets | 2x Micro SIM Socket (Attached to M.2 B Key ) | 1x External Micro SIM socket (Attached to M.2 B Key) | 1x External Dual Nano SIM socket (Attached to M.2 B Key) |
|
| I/O | Ethernet | Onboard: 2 x RJ45 (1 Gbe, 1x10 GbE) with EBIO: Up to 5 x 10 GbE (RJ45) OR Up to 9 x 1 GbE (RJ45 or M12) |
Onboard: 2 x RJ45 OR 4 x RJ45 |
Onboard: 1x RJ45 |
| PoE | EBIO: can support 4 x RJ45 with optional PoE JCO-6000-ORN-A: up to 4 PoE JCO-6000-ORN-B: up to 12 PoE |
JCO-3000-ORN-B: Up to 4 PoE |
(-) | |
| USB 2.0 | 1 | (-) | 2 | |
| USB 3.0 | On-board: 1x USB 3.2 Gen 2 (10 Gbps, USB 3 Vision Locking Compliant) With EBIO: can support 8 x USB 3 (5 Gbps, 8 dedicate port) |
4 x USB 3.0 (5Gbps) | 2x USB 3.2 Gen 2 (10 Gbps) | |
| Serial | 2x RS-232/422/485 |
2x RS-232/485 (Internal, switch by Jumper) | 2x RS-232/422/485 | |
| CAN | Up to 2 x CAN FD (isolated) | CAN 2.0 A | CAN 2.0 A |
|
| Power Ignition Sensing | Adjustable Power Ignition Management | (-) | (-) | |
| Digital I/O | 8 in / 8 out (Isolated) | 4 in / 4 out (Isolated) | 4 in / 4 out (Isolated) | |
| Video Out | 1 x HDMI 4k (3840 x 2160) 60Hz | 1x HDMI 2K (2560*1440) 60Hz | 1x HDMI 4k (3840 x 2160) 60Hz | |
| GMSL Camera | 2x Quad Port Mini Fakra (8 GMSL) | (-) | (-) | |
| Out-of-Band Managment | Optional 1x RJ45 | Optional 1x RJ45 | (-) | |
| EDGEBoost I/O Expansion | up to 4 EBIO • 4-port GbE module with Intel® I350 Chipset, RJ-45/M12 connector (PoE optional) • 2-Port RJ45 10GbE with Intel X710 Chipset • 4-Port USB 3.0 • 4-Port USB 3.0 (Locking Ports) • 1x M.2 M-Key |
(-) | (-) | |
| Connectivity | Cellular 4G LTE / 5G | 1x M.2 (B Key, 3042/3052, USB 3.2 Gen2, Support 4G/5G Module) |
1x M.2 (B Key, 3042/3052, USB 3.2 Gen1, Support 4G/5G) | 1x M.2 (B Key, 2242/3042/3052, PCIe x1, USB 3.2 Gen1, Support 4G/5G Module) |
| Wi-Fi/BT | 1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/BT) | 1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/Bluetooth) | 1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/Bluetooth) | |
| Antenna | 6x WiFi Antenna Holes | 6x WiFi Antenna Holes | 6x WiFi Antenna Holes | |
| Environmental | Operating Temperature | -20°C to 60°C |
-25°C to 55°C (25W, NX Module) -20°C to 60°C (15W, Nano Module) |
-25°C to 70°C |
| Shock & Vibration | Vibration: With SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis Shock: With SSD: 50G, half sine, 11ms |
Vibration: With SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis Shock: With SSD: 50G, half sine, 11ms |
Vibration: With SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis Shock: With SSD: 50G, half sine, 11ms |
|
| Safety | CE, FCC, UL-Listed (pending) | CE, FCC, UL-Listed (pending) | CE, FCC, UL-Listed (pending) | |
| System Cooling | Fanless Cooling | Fanless Cooling | Fanless Cooling | |
| Size | Mechanical Dimensions | 270 (W) x 190 (D) x 95 (H) mm 10.6" x 7.48" x 3.74" |
192 (W) x 227(D) x 57.6(H) mm 7.56" x 8.94" x 2.27" |
150 (W) x 105 (D) x 61 (H) mm 5.91" x 4.13" x 2.4" |
Markets
Behind NVIDIA Jetson: Understand the Adoption of ARM Architecture
- NVIDIA Jetson Orin modules adopt ARM SoM (System-on-the-Module) Architecture, incorporating CPU, GPU, memory on the same module.
- ARM adopts a RISC (Reduced Instruction Set Computing) philosophy, simplifies hardware design for optimized speed and energy efficiency.
- Allows for low power consumption and less heat generation, aligning with the rugged edge computing demands
- Enhances AI and ML, well suited for AI platforms such as NVIDIA Jetson
Elevated Autonomous Systems Powered by NVIDIA Jetson
By leveraging NVIDIA Jetson, Premio offers cutting-edge solutions for AGV and AMR robotics, ensuring unparalleled performance in the most demanding environments.
- Versatile Edge Computing for AI and machine learning
- Perception with Precision for advanced IoT sensors and cameras
- Streamlined Software Development with NVIDIA Jetpack SDK
Why Premio? Built Rugged. Built Ready.
- 30+ years of extensive design expertise for industrial-grade compute, storage, rich I/O, and high-speed connectivity
- Global turnkey manufacturing and support infrastructure in the USA
- Regulatory testing and compliance for rugged industrial computers
- Long Product Life Cycles to ensure reliability
